Rework Device SUMMIT Series
Large substrate compatible rework device SUMMIT. It minimizes substrate warping with advanced temperature control.
A high-performance SMD/BGA rework station that minimizes thermal stress on the implemented components and achieves a highly reproducible heating profile. It demonstrates its true value particularly in the rework of large substrates, high thermal dissipation substrates that are difficult to heat, and high-value-added assembly substrates.
- Company：シンアペックス
- Price：Other
